EVOCHEM’s new super-hydrophobic product line (EVOCHEM ETC-ULTRA & EVOCHEM ETC-PRO) provides superior process and film properties. We have developed sophisticated materials that reduce the adherence of dirt and fingerprints on surfaces while at the same time increasing the scratch resistance.
The new super-hydrophobic tablets can be deposited from resistively heated boats as well as by E-Beam using a Top Coat liner.
While leading the way into next generation’s coatings, EVOCHEM’s new product portfolio already complies with the latest legislatives requirements and does not contain Perfluorooctanesulfonic acid (PFOS) and Perflurooctanoic acid (PFOA) – neither in the product nor in the entire production line.
We provide one of the largest, most comprehensive lines of sputtering target materials. All popular geometries (and sizes) and materials are available.
Sputtering Targets are available as precious metals and non-precious metals sputtering targets, customised alloys and as ceramic sputtering targets with individual chemistry. To achieve the desired characteristics in a sputtered thin film, the manufacturing process used to fabricate the sputtering target can be critical. Whether the sputtering target material comprises only an element (pure metal), mixture of elements, alloys, or perhaps a compound - the process to produce that defined material in a form suitable for sputtering thin films of consistent quality is as essential as the deposition parameters.
We also provide in-house sputter target bonding and precious metals reclamation services, saving you both time and money.
Sputter deposition (sputtering) is a widely used PVD-technique to deposit thin films on substrates. The technique is based upon ion bombardment of a source material, the sputtering target. The most common method for growing thin films by sputter deposition (sputtering) is the use of a magnetron source in which positive ions present in the plasma of a magnetically enhanced glow discharge bombard the sputtering target or sputtering targets. The sputtering target can be powered in different ways, ranging from dc for conductive sputtering targets (dc-sputtering), to rf (rf sputtering) for non-conductive sputtering targets.
By applying a magnetic field during sputtering (magnetron sputtering) process it is possible to trap the electrons in the discharge longer and produce more ions to bombard the sputtering target for the same electron density. Magnetron sputtering increases the efficiency of the initial ionization process and allows for creating the plasma at lower pressures, reducing both background gas incorporation in the growing film and energy losses in the sputtered atom through gas collisions. Hence magnetron sputtering increases the sputtering rate (deposition rate) dramatically.
A very common and economical way to operate the magnetron is using a dc power supply. Arcs often occur during reactive sputter deposition of, for example, non-conductive oxides from a metal target in pure O2 or mixed Ar/O2 discharges, due to a build up of oxide on the edges of the erosion groove where the sputtering rate is low. Arcing can seriously damage the sputtering target by local melting in the sputtering targets, but it also degrades quality of the deposited film due to the presence of particulates and/or pinholes while eventually destroying the power supply.
An effective way to prevent arcing during reactive magnetron sputtering process is pulsing the applied voltage. An alternative method for solving the arcing problem is the use of two magnetron sources, i.e. dual magnetron sputtering, and switch the negative and positive voltage between the two sputtering targets. In this way, each magnetron alternately has the function of a sputtering target and an anode. Thus, both sputtering targets can be neutralized during each cycle.
We customize evaporation materials to your specifications and requirements. Our ultra-high purity evaporation materials deliver optimal evaporative performance and coating results. Our evaporation materials represent the finest coating materials available today which have been processed or especially developed to meet demanding requirements of scientific experimentation, product and process development or full-scale production. Our blue-chip customer base is a proof of the reliability and performance our evaporation materials.
Physical vapor deposition processes (PVD-processes) are deposition processes in which an evaporation material is vaporized from a solid source in the form of atoms and is transported in the form of vapour through a vacuum or low pressure (or plasma) environment to the substrate where the vapour condeneses.
PVD-processes can be used to deposit films of elements (evaporation materials) and alloys using reactive deposition processes. Vacuum deposition is a PVD-process in which the evaporation material from a thermal vaporization source reaches the substrate with little or no collision with gas molecules. Vacuum deposition is used to form optical interference coatings, mirror coatings, decorative coatings, electrically conducting films (also TCO films, ITO), wear resistant coatings, and corrosion protective coatings.