Bonding required?

Bonding required?

We have it all: Indium, Nano and Epoxy Bonding

Sputtering Targets - Target Bonding

Depending on the particular system and material your target may require bonding. Backing plates can be fabricated to match virtually any target composition and configuration. We will perform bonding/de-bonding of targets ordered from us or of targets and backing plates provided by the customer. 

Sputtering Targets - Indium Bonding

Indium is the preferred solder for bonding sputtering targets because it has the best thermal conductivity.The softer solder allows some "give" when the target expands at a different rate than the backing plate.


The main limitation of the indium bond is the melting temperature of the indium solder. Indium has a melting point of 157°C so temperatures in excess of 150°C will cause the bond to melt and fail. Most materials can be indium bonded but there are a few exceptions.


If your Sputter process has temperatures higher than 157°C we recommend Nano Bonding of your Target.

Sputtering Targets - Nano Bonding

Nano Bonding is a  process for bonding components utilizing Nano Bond Foil. Activated by a small pulse of energy the bonding process is completed in a fraction of a second.


The process enables high strength, high conductivity bonds between most combinations of materials making it ideal for many joining and assembly operations.


The multilayer Nano Bond Foil is placed between two components to be bonded along with the heat from the Nano Foil’s reaction melts the solder and enables metallic bonding at room temperature.

Company News

EVOCHEM exhibits in Munich, 26-29 June 2017

EVOCHEM as exhibitor and sponsor

EVOCHEM officially certified by DEKRA

Silicon Targets