Sputtering Targets » Bonding Services / Backing Plates
Depending on the particular system and material your target may require bonding. Backing plates can be fabricated to match virtually any target composition and configuration. We will perform bonding/de-bonding of targets ordered from us or of targets and backing plates provided by the customer. We also provide silver-filled epoxy cement containing the optimum ratio of silver powder to epoxy resin for maximum thermal and electrical conductivity and mechanical strength.
| Name |
Formula |
Purity |
| Aluminium |
Al |
5N |
| Copper (OFHC) |
Cu |
4N |
| Stainless Steel |
Fe |
4N |
| Molybdenum |
Mo |
3N5 |
| Nickel |
Ni |
4N |
